Invention Grant
- Patent Title: Heat dissipation structure
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Application No.: US16817808Application Date: 2020-03-13
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Publication No.: US11219138B2Publication Date: 2022-01-04
- Inventor: Takahiro Yagi
- Applicant: NEC Platforms, Ltd.
- Applicant Address: JP Kawasaki
- Assignee: NEC Platforms, Ltd.
- Current Assignee: NEC Platforms, Ltd.
- Current Assignee Address: JP Kawasaki
- Priority: JPJP2019-050128 20190318
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/02

Abstract:
A heat dissipation structure capable of improving heat dissipation efficiency and regulating temperature distribution of a surface of a housing is provided. A heat dissipation structure 300 is provided in a housing 200 that accommodates a heat generating source 102 therein, the heat dissipation structure 300 including: top surface parts 213 and 223 opposed to each other, in which the top surface part 213 includes a plurality of concave-shaped parts 213B-F that are aligned, the top surface part 223 includes a plurality of concave-shaped parts 223B-F that are aligned, the concave-shaped parts 213B-F of the top surface part 213 are opposed to the concave-shaped parts 223B-F of the top surface part 223, outlets 213A are formed in the concave-shaped parts 213D, 213E, and 213F, and outlets 223A are formed in the concave-shaped parts 223C, 223D, 223E, and 223F.
Public/Granted literature
- US20200305303A1 HEAT DISSIPATION STRUCTUR Public/Granted day:2020-09-24
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