Invention Grant
- Patent Title: Fan-less chiller-less liquid-air cooling for electronic racks of IT components in data centers
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Application No.: US16856320Application Date: 2020-04-23
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Publication No.: US11219141B2Publication Date: 2022-01-04
- Inventor: Tianyi Gao , Yan Cui , Xiaogang Sun , Ali Heydari
- Applicant: Baidu USA LLC , Baidu.com Times Technology (Beijing) Co., Ltd.
- Applicant Address: US CA Sunnyvale; CN Beijing
- Assignee: Baidu USA LLC,Baidu.com Times Technology (Beijing) Co., Ltd.
- Current Assignee: Baidu USA LLC,Baidu.com Times Technology (Beijing) Co., Ltd.
- Current Assignee Address: US CA Sunnyvale; CN Beijing
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
Public/Granted literature
- US20200253089A1 FAN-LESS CHILLER-LESS LIQUID-AIR COOLING FOR ELECTRONIC RACKS OF IT COMPONENTS IN DATA CENTERS Public/Granted day:2020-08-06
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