Invention Grant
- Patent Title: 3D stacked high-density memory cell arrays and methods of manufacture
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Application No.: US16861065Application Date: 2020-04-28
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Publication No.: US11222681B2Publication Date: 2022-01-11
- Inventor: Harry Luan
- Applicant: TC Lab, Inc.
- Applicant Address: US CA Gilroy
- Assignee: TC Lab, Inc.
- Current Assignee: TC Lab, Inc.
- Current Assignee Address: US CA Gilroy
- Agency: Aka Chan LLP
- Main IPC: G11C11/39
- IPC: G11C11/39 ; H01L27/108 ; H01L27/102 ; H01L27/105 ; H01L29/74 ; H01L29/87 ; H01L29/06 ; H01L29/66

Abstract:
Integrated circuit devices having multiple level arrays of thyristor memory cells are created using a stack of ONO layers through which NPNPNPN layered silicon pillars are epitaxially grown in-situ. Intermediate conducting lines formed in place of the removed nitride layer of the ONO stack contact the middle P-layer of silicon pillars. The silicon pillars form two arrays of thyristor memory cells, one stacked upon the other, having the intermediate conducting lines as common connections to both arrays. The stacked arrays can also be provided with assist-gates.
Public/Granted literature
- US20200258562A1 3D Stacked High-Density Memory Cell Arrays and Methods of Manufacture Public/Granted day:2020-08-13
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