Invention Grant
- Patent Title: Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same
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Application No.: US16817627Application Date: 2020-03-13
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Publication No.: US11222804B2Publication Date: 2022-01-11
- Inventor: Brent Donald Alfred Elliot , Frank Balma , Michael Parker , Jason Stephens , Guleid Hussen
- Applicant: Watlow Electric Manufacturing Company
- Applicant Address: US MO St. Louis
- Assignee: Watlow Electric Manufacturing Company
- Current Assignee: Watlow Electric Manufacturing Company
- Current Assignee Address: US MO St. Louis
- Agency: Burris Law, PLLC
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H01L21/683 ; B23Q3/15 ; B23K1/00 ; C04B37/00 ; H01L21/687 ; B23K1/19 ; B23K1/20 ; B23K1/008 ; B23K103/18 ; B23K103/00 ; B23K101/42

Abstract:
An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C to 750 C.
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