Invention Grant
- Patent Title: Electronic device mounting structure and mounting device to mount such electronic device
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Application No.: US16551575Application Date: 2019-08-26
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Publication No.: US11222829B2Publication Date: 2022-01-11
- Inventor: Chien-Shou Liao
- Applicant: Skiileux Electricity Inc.
- Applicant Address: TW Taoyuan
- Assignee: Skiileux Electricity Inc.
- Current Assignee: Skiileux Electricity Inc.
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Priority: TW108108998 20190315
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/065 ; H01L25/075 ; H01L23/498 ; H01L33/62 ; H01L23/00
Abstract:
A chip mounting structure and a chip mounting device are provided. The chip mounting structure includes a circuit substrate and a plurality of micro heaters. The circuit substrate has a plurality of solder pads. A plurality of micro heaters are disposed on the circuit substrate adjacent to the solder pad. The plurality of chips are disposed on the circuit substrate, and the chip is electrically connected to the solder pad by a solder ball. Therefore, the soldering yield of the process can be reduced by the chip mounting structure and the chip mounting device.
Public/Granted literature
- US20200294879A1 CHIP MOUNTING STRUCTURE AND CHIP MOUNTING DEVICE Public/Granted day:2020-09-17
Information query
IPC分类:
