Invention Grant
- Patent Title: Low-inductance current paths for on-package power distributions and methods of assembling same
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Application No.: US16838556Application Date: 2020-04-02
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Publication No.: US11222837B2Publication Date: 2022-01-11
- Inventor: Andrew Collins , Jianyong Xie , Sujit Sharan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/16 ; H01L23/42 ; H01L49/02 ; H01L21/48
Abstract:
A micro-trace containing package substrate provides a low-inductance alternating-current decoupling path between a semiconductive device and a die-side capacitor.
Public/Granted literature
- US20200235048A1 LOW-INDUCTANCE CURRENT PATHS FOR ON-PACKAGE POWER DISTRIBUTIONS AND METHODS OF ASSEMBLING SAME Public/Granted day:2020-07-23
Information query
IPC分类:
