Invention Grant
- Patent Title: Moisture barrier for bond pads and integrated circuit having the same
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Application No.: US16992405Application Date: 2020-08-13
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Publication No.: US11222855B2Publication Date: 2022-01-11
- Inventor: Jiro Yota , Shiban Kishan Tiku
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US CA Irvine
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/66

Abstract:
A semiconductor die includes a substrate layer, one or more metal layers disposed over the substrate layer, and a pair of polyimide layers disposed over the substrate so that they define an interface therebetween. One or both of the pair of polyimide layers have a trench that separates the interface from the one or more metal layers. The trench can be formed by etching the polyimide layer(s). A topcoat insulation layer is disposed over the one or more metal layers and polyimide layers. The topcoat insulation layer is impervious to moisture and the trench inhibits migration of moisture along the interface to the one or more metal layers, thereby preventing metal migration from the one or more metal layers along the interface.
Public/Granted literature
- US20210074652A1 MOISTURE BARRIER FOR BOND PADS AND INTEGRATED CIRCUIT HAVING THE SAME Public/Granted day:2021-03-11
Information query
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