Invention Grant
- Patent Title: Semiconductor structures including liners comprising alucone and related methods
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Application No.: US16446746Application Date: 2019-06-20
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Publication No.: US11223014B2Publication Date: 2022-01-11
- Inventor: Zhe Song , Tuman E. Allen , Cole S. Franklin , Dan Gealy
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/11582 ; H01L21/02 ; H01L27/24 ; H01L21/033 ; H01L27/1157
Abstract:
A semiconductor device including stacked structures. The stacked structures include at least two chalcogenide materials or alternating dielectric materials and conductive materials. A liner including alucone is formed on sidewalls of the stacked structures. Methods of forming the semiconductor device are also disclosed.
Public/Granted literature
- US20190312200A1 SEMICONDUCTOR STRUCTURES INCLUDING LINERS COMPRISING ALUCONE AND RELATED METHODS Public/Granted day:2019-10-10
Information query
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