- Patent Title: Waterproof electronic component and method for assembling the same
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Application No.: US16918286Application Date: 2020-07-01
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Publication No.: US11223158B2Publication Date: 2022-01-11
- Inventor: Satoshi Yamanaka , Masanori Inoue
- Applicant: HOSIDEN CORPORATION
- Applicant Address: JP Osaka
- Assignee: HOSIDEN CORPORATION
- Current Assignee: HOSIDEN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Dilworth & Barrese, LLP
- Priority: JPJP2019-125537 20190704,JPJP2019-125538 20190704
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H01R13/52 ; F21V19/00 ; F21Y115/10

Abstract:
This disclosure provides a waterproof electronic component having good waterproofness and a method for assembling the waterproof electronic component. A repeater as a waterproof electronic component includes (i) a substrate having first through holes, (ii) a socket fixed to the substrate, (iii) a housing containing the substrate, (iv) a pin held by the housing and having a first end connected to the substrate, and (v) a sealing section with which an area surrounded by the substrate and the housing is filled, the housing including a support including a supportive wall section capable of supporting a fixation portion of the socket and a seat section having a seating surface on which the substrate is placed, the substrate being placed on the seat section, the socket being oriented in such a manner that at least a portion of an outer surface of the fixation portion is close to and faces the supportive wall section.
Public/Granted literature
- US20210006005A1 WATERPROOF ELECTRONIC COMPONENT AND METHOD FOR ASSEMBLING THE SAME Public/Granted day:2021-01-07
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