- Patent Title: Method for manufacturing an opening structure and opening structure
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Application No.: US16559646Application Date: 2019-09-04
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Publication No.: US11223904B2Publication Date: 2022-01-11
- Inventor: Wolfgang Friza
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H04R7/14 ; H04R31/00 ; B81C1/00 ; H04R19/00 ; H04R19/02 ; H04R19/04

Abstract:
A method for manufacturing an opening structure is provided. The method may include: forming a patterned mask over a first side of a carrier; forming material over the first side of the carrier covering at least a portion of the carrier; forming a first opening in the carrier from a second side of the carrier opposite the first side of the carrier to at least partially expose a surface of the patterned mask; and forming a second opening in the material from the second side of the carrier using the patterned mask as a mask.
Public/Granted literature
- US20200015017A1 METHOD FOR MANUFACTURING AN OPENING STRUCTURE AND OPENING STRUCTURE Public/Granted day:2020-01-09
Information query
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