Invention Grant
- Patent Title: Method and apparatus for single-sided clamp-up
-
Application No.: US16230189Application Date: 2018-12-21
-
Publication No.: US11224950B2Publication Date: 2022-01-18
- Inventor: Harinder S. Oberoi , Kevin Marion Barrick , Charles Yuanxin Hu
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Haynes and Boone, LLP
- Main IPC: B23Q3/00
- IPC: B23Q3/00 ; B23Q3/08 ; B64C1/06 ; F16B5/04 ; B25J15/00 ; B23B39/14 ; F16B1/00 ; B25J15/06
Abstract:
Methods and apparatuses for aligning a first hole in a first panel with a second hole in a second panel to define a through-hole. A wall that defines the second hole is gripped from within the through-hole to pull the second panel towards the first panel and thereby establish a clamp-up of the first panel and the second panel.
Information query
IPC分类:
