Invention Grant
- Patent Title: System for setting molding conditions of injection-molding equipment
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Application No.: US16911082Application Date: 2020-06-24
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Publication No.: US11225005B2Publication Date: 2022-01-18
- Inventor: Rong-Yeu Chang , Chia-Hsiang Hsu , Chuan-Wei Chang
- Applicant: CORETECH SYSTEM CO., LTD.
- Applicant Address: TW Chupei
- Assignee: CORETECH SYSTEM CO., LTD.
- Current Assignee: CORETECH SYSTEM CO., LTD.
- Current Assignee Address: TW Chupei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: B29C45/76
- IPC: B29C45/76 ; G06F30/20 ; G06F30/10 ; G06F119/18 ; G06F113/22

Abstract:
A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.
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