Invention Grant
- Patent Title: Vehicle circuit body
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Application No.: US17033648Application Date: 2020-09-25
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Publication No.: US11225207B2Publication Date: 2022-01-18
- Inventor: Hayato Yamaguchi , Akira Tsubaki , Sadaharu Okuda , Masahiro Takamatsu
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JPJP2019-177673 20190927
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H01B7/08 ; H01B7/04

Abstract:
A vehicle circuit body is provided. The vehicle circuit body includes a bent portion which is formed by bending a plurality of conductor plates with a convex shape toward one side of a lamination direction in which the plurality of conductor plates are laminated, the plurality of conductor plates being laminated such that adjacent conductor plates are spaced apart from each other; and a rigid portion where the plurality of conductor plates extending from the bent portion are joined together to form a single layer. The bent portion is arranged at a position which faces an inner corner or outer corner of a concave-convex shape formed on a body panel.
Public/Granted literature
- US20210094487A1 VEHICLE CIRCUIT BODY Public/Granted day:2021-04-01
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