Invention Grant
- Patent Title: Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
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Application No.: US16284517Application Date: 2019-02-25
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Publication No.: US11225712B2Publication Date: 2022-01-18
- Inventor: Joshua Collins , Siew Neo , Hanna Bamnolker , Kapil Umesh Sawlani
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: C23C16/02
- IPC: C23C16/02 ; C23C16/04 ; C23C16/14 ; C23C16/455

Abstract:
A method for depositing tungsten includes arranging a substrate including a titanium nitride layer in a substrate processing chamber and performing multi-stage atomic layer deposition of tungsten on the substrate using a precursor gas includes tungsten chloride (WCIx) gas, wherein x is an integer. The performing includes depositing the tungsten during a first ALD stage using a first dose intensity of the precursor gas, and depositing the tungsten during a second ALD stage using a second dose intensity of the precursor gas. The first dose intensity is based on a first dose concentration and a first dose period. The second dose intensity is based on a second dose concentration and a second dose period. The second dose intensity is 1.5 to 10 times the first dose intensity.
Public/Granted literature
- US20190185992A1 ATOMIC LAYER DEPOSITION OF TUNGSTEN FOR ENHANCED FILL AND REDUCED SUBSTRATE ATTACK Public/Granted day:2019-06-20
Information query
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