Invention Grant
- Patent Title: Fine silver particle dispersion
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Application No.: US16374882Application Date: 2019-04-04
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Publication No.: US11227702B2Publication Date: 2022-01-18
- Inventor: Shingo Teragawa , Takashi Hinotsu , Dave Hui , Michael Stephen Wolfe , Howard David Glicksman , Haixin Yang
- Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B22F9/24 ; B22F1/00

Abstract:
This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.
Public/Granted literature
- US20200321139A1 FINE SILVER PARTICLE DISPERSION Public/Granted day:2020-10-08
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