Invention Grant
- Patent Title: Transfer support and transfer module
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Application No.: US16026080Application Date: 2018-07-03
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Publication No.: US11227787B2Publication Date: 2022-01-18
- Inventor: Ming-Hsien Wu , Yih-Der Guo , Yen-Hsiang Fang , Yao-Jun Tsai , Yi-Chen Lin
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW10612359.8 20170714,TW10711140.7 20180330
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67

Abstract:
A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.
Public/Granted literature
- US20190019718A1 TRANSFER SUPPORT AND TRANSFER MODULE Public/Granted day:2019-01-17
Information query
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