Invention Grant
- Patent Title: Chip-on-chip power card with embedded thermal conductor
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Application No.: US16854748Application Date: 2020-04-21
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Publication No.: US11227821B2Publication Date: 2022-01-18
- Inventor: Feng Zhou
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US TX Plano
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US TX Plano
- Agency: Snell & Wilmer LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/427 ; F28D15/02 ; H01L23/31

Abstract:
Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame and a P lead frame, each having a body portion and a terminal portion. The power card includes an O lead frame having a body portion and a cooling portion. The power card includes a first power device located between the body portion of the N lead frame and the body portion of the O lead frame. The power card includes a second power device located between the body portion of the O lead frame and the body portion of the P lead frame, the O lead frame configured to receive heat from the first power device and the second power device by the body portion of the O lead frame and transfer the heat to the cooling portion of the O lead frame for heat dissipation.
Public/Granted literature
- US20210327793A1 CHIP-ON-CHIP POWER CARD WITH EMBEDDED THERMAL CONDUCTOR Public/Granted day:2021-10-21
Information query
IPC分类: