- Patent Title: Display substrate motherboard and method for manufacturing the same
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Application No.: US16649787Application Date: 2019-08-30
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Publication No.: US11227839B2Publication Date: 2022-01-18
- Inventor: Lili Du , Yue Long , Hongjun Zhou , Erlong Song , Chao Zeng
- Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Sichuan; CN Beijing
- Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201811279971.9 20181030
- International Application: PCT/CN2019/103715 WO 20190830
- International Announcement: WO2020/088082 WO 20200507
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L27/12 ; H01L51/56

Abstract:
The disclosure relates to the field of display technology. A display substrate motherboard and a method for manufacturing the same are disclosed. In the technical solution provided by the embodiments of the disclosure, by providing via holes formed in the film, instead of small area island-like film patterns, as stitch marks of the display substrate motherboard, a possibility of stitch mark peeling is reduced, thereby further ensuring a reliability and yield of product.
Public/Granted literature
- US20210074649A1 DISPLAY SUBSTRATE MOTHERBOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-03-11
Information query
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