Invention Grant
- Patent Title: FinFET devices with a fin top hardmask
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Application No.: US15981638Application Date: 2018-05-16
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Publication No.: US11227932B2Publication Date: 2022-01-18
- Inventor: Kuo-Cheng Ching , Kai-Chieh Yang , Ching-Wei Tsai , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/78 ; H01L21/28 ; H01L29/66

Abstract:
Aspects of the disclosure provide a fin field effect transistor (FinFET) incorporating a fin top hardmask on top of a channel region of a fin. Because of the presence of the fin top hardmask, a gate height of the FinFET can be reduced without affecting proper operations of vertical gate channels on sidewalls of the fin. Consequently, parasitic capacitance between a gate stack and source/drain contacts of the FinFET can be reduced by lowering the gate height of the FinFET.
Public/Granted literature
- US20190355827A1 FINFET DEVICES WITH A FIN TOP HARDMASK Public/Granted day:2019-11-21
Information query
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