Invention Grant
- Patent Title: Lateral double-diffused metal oxide semiconductor component and manufacturing method therefor
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Application No.: US16645139Application Date: 2018-09-01
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Publication No.: US11227948B2Publication Date: 2022-01-18
- Inventor: Nailong He , Sen Zhang , Xuchao Li
- Applicant: CSMC TECHNOLOGY FAB2 CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: CSMC TECHNOLOGY FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGY FAB2 CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: Polsinelli PC
- Priority: CN201710801871.7 20170907
- International Application: PCT/CN2018/900005 WO 20180901
- International Announcement: WO2019/047988 WO 20190314
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/78 ; H01L21/762 ; H01L29/06 ; H01L29/66

Abstract:
A lateral double-diffused metal oxide semiconductor component and a manufacturing method therefor. The lateral double-diffused metal oxide semiconductor component comprises: a semiconductor substrate, the semiconductor substrate being provided thereon with a drift area; the drift area being provided therein with a trap area and a drain area, the trap area being provided therein with an active area and a channel; the drift area being provided therein with a deep trench isolation structure arranged between the trap area and the drain area, and the deep trench isolation structure being provided at the bottom thereof with alternately arranged first p-type injection areas and first n-type injection areas.
Public/Granted literature
- US20210036150A1 LATERAL DOUBLE-DIFFUSED METAL OXIDE SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2021-02-04
Information query
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