Invention Grant
- Patent Title: Semiconductor light emitting element and method of manufacturing semiconductor light emitting element
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Application No.: US16846706Application Date: 2020-04-13
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Publication No.: US11227976B2Publication Date: 2022-01-18
- Inventor: Noritaka Niwa , Tetsuhiko Inazu
- Applicant: NIKKISO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIKKISO CO., LTD.
- Current Assignee: NIKKISO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds and Lowe, P.C.
- Main IPC: H01L33/32
- IPC: H01L33/32 ; H01L33/00 ; H01L33/54 ; H01L33/56 ; H01L33/36 ; H01L33/44

Abstract:
A semiconductor light emitting element includes: an n-type semiconductor layer made of an n-type aluminum gallium nitride (AlGaN)-based semiconductor material provided on a substrate; an active layer made of an AlGaN-based semiconductor material provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a covering layer made of a dielectric material that covers the n-type semiconductor layer, the active layer, and the p-type semiconductor layer. Each of the active layer and the p-type semiconductor layer has a sloped surface that is sloped at a first angle with respect to the substrate and is covered by the covering layer. The n-type semiconductor layer has a sloped surface that is sloped at a second angle larger than the first angle with respect to the substrate and is covered by the covering layer.
Public/Granted literature
- US20200335664A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT Public/Granted day:2020-10-22
Information query
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