Invention Grant
- Patent Title: Deep molded reflector cup used as complete LED package
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Application No.: US15104475Application Date: 2014-12-23
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Publication No.: US11227982B2Publication Date: 2022-01-18
- Inventor: Mark Melvin Butterworth
- Applicant: Lumileds LLC
- Applicant Address: US CA San Jose
- Assignee: Lumileds LLC
- Current Assignee: Lumileds LLC
- Current Assignee Address: US CA San Jose
- Agency: Volpe Koenig
- International Application: PCT/IB2014/067266 WO 20141223
- International Announcement: WO2015/104619 WO 20150716
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/50 ; H01L33/52 ; H01L33/60 ; H01L33/62 ; H01L33/64

Abstract:
An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of electrodes exposed at the bottom area of the cup for electrically contacting a set of LED die electrodes (18, 20). The lead frame also forms a second set of electrodes outside of the cup for connection to a power supply. A reflective metal (28) is then deposited on the curved walls of the cup. An LED die (16) is mounted at the bottom area of the cup and electrically connected to the first set of electrodes. The cup is then partially filled with an encapsulant (64) containing a phosphor (66).
Public/Granted literature
- US20160322549A1 DEEP MOLDED REFLECTOR CUP USED AS COMPLETE LED PACKAGE Public/Granted day:2016-11-03
Information query
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