The present disclosure provides a packaging cover plate, a method for manufacturing the same and a light emitting diode display, the packaging cover plate includes a cover plate body and a groove structure disposed on a first surface of the cover plate body, wherein the cover plate body comprises a flexible ceramic material, and the groove structure is filled with an adhesive material and a thermally conductive material. The packaging cover plate provided by the present disclosure has a bending property while having a barrier to water and oxygen, and does not undergo a shape change due to thermal expansion and contraction under a change of the ambient temperature. In addition, the present disclosure can improve the adhesion between the package cover plate and the packaging adhesive and improve the heat dissipation effect.