Invention Grant
- Patent Title: Antenna package structure and antenna packaging method
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Application No.: US16354464Application Date: 2019-03-15
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Publication No.: US11228087B2Publication Date: 2022-01-18
- Inventor: Yenheng Chen , Chengchung Lin , Chengtar Wu , Jangshen Lin
- Applicant: SJ Semiconductor (Jiangyin) Corporation
- Applicant Address: CN Jiangyin
- Assignee: SJ Semiconductor (Jiangyin) Corporation
- Current Assignee: SJ Semiconductor (Jiangyin) Corporation
- Current Assignee Address: CN Jiangyin
- Agency: Alston & Bird LLP
- Priority: CN201810217683.4 20180316,CN201820359524.3 20180316
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01Q1/22 ; H01Q21/00 ; H01Q9/04 ; H01Q21/06 ; H01L23/00
Abstract:
The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.
Public/Granted literature
- US20190288373A1 ANTENNA PACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD Public/Granted day:2019-09-19
Information query
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