The application describes an antenna packaging module for a semiconductor chip and a method for making it. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaging antenna connector. The antenna structure comprises a connector opening, a first antenna structure and a second antenna structure stacked on the second surface of the redistribution layer. The packaging antenna connector is disposed in the connector opening, and is electrically connected to the redistribution layer. Electrical interconnection of packaging an antenna connector in a connector opening in the packaging layer, the antenna signal loss is reduced, and the overall e advantage of WLP AiP is further improved.