Invention Grant
- Patent Title: Microphone module for computing device
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Application No.: US16603287Application Date: 2017-04-24
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Publication No.: US11228827B2Publication Date: 2022-01-18
- Inventor: Chyun Nan Liu , Chung Hua Ku
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2017/029204 WO 20170424
- International Announcement: WO2018/199906 WO 20181101
- Main IPC: H04R1/04
- IPC: H04R1/04

Abstract:
A computing device includes a housing and a microphone module. The microphone module may be connected to the housing and selectively manipulated between an attached and detached state. In an attached state, the microphone of the microphone module is operatively linked to one or more electrical components of the housing. In a detached state, the microphone is disconnected from the one or more electronic components.
Public/Granted literature
- US20210112325A1 MICROPHONE MODULE FOR COMPUTING DEVICE Public/Granted day:2021-04-15
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