Invention Grant
- Patent Title: Method of manufacturing the printed board
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Application No.: US15719565Application Date: 2017-09-29
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Publication No.: US11229123B2Publication Date: 2022-01-18
- Inventor: Masaaki Katsumata , Masakazu Sakamoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JPJP2016-192932 20160930
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/42 ; H05K1/03 ; H05K3/40 ; H05K3/06 ; H05K3/38

Abstract:
A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.
Public/Granted literature
- US20180098434A1 METHOD OF MANUFACTURING THE PRINTED BOARD Public/Granted day:2018-04-05
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