Invention Grant
- Patent Title: Method for forming redistribution layer using photo-sintering
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Application No.: US16387742Application Date: 2019-04-18
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Publication No.: US11229124B2Publication Date: 2022-01-18
- Inventor: SeungBoo Jung , KwangHo Jung , WooRam Myung , HakSan Jeong , BumGeun Park , ChoongJae Lee , KyungDeuk Min
- Applicant: Research & Business Foundation Sungkyunkwan University
- Applicant Address: KR Suwon-si
- Assignee: Research & Business Foundation Sungkyunkwan University
- Current Assignee: Research & Business Foundation Sungkyunkwan University
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0047651 20180425
- Main IPC: H05K3/12
- IPC: H05K3/12

Abstract:
The present invention relates to a method for formation of a redistribution layer using photo-sintering and to the redistribution layer formed by the method. The method for forming a redistribution layer using photo-sintering includes printing, on a substrate, a liquid electrode pattern for a redistribution layer; coating a transparent polymer on the substrate and the pattern; photo-sintering the electrode pattern using photonic energy; and evaporating an organic substance contained in the liquid electrode pattern via the photo-sintering to remove the polymer on a top face of the electrode pattern to form a redistribution layer as the sintered electrode pattern.
Public/Granted literature
- US20190335590A1 METHOD FOR FORMING REDISTRIBUTION LAYER USING PHOTO-SINTERING Public/Granted day:2019-10-31
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