Invention Grant
- Patent Title: Air baffle component, heat dissipation apparatus, and server
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Application No.: US16911030Application Date: 2020-06-24
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Publication No.: US11229145B2Publication Date: 2022-01-18
- Inventor: Huan Peng , Gaoliang Xia
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Hauptman Ham, LLP
- Priority: CN201810380115.6 20180425
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
An air baffle component includes an air baffle rotationally connected to a housing of a device chassis having a module insertion port. The air baffle component also includes a level-1 elastic component. The air baffle component further includes a level-2 elastic component. The air baffle component additionally includes a connecting rod. The connecting rod includes a force-bearing rod rotationally connected to the housing of the device chassis between the air baffle and the module insertion port. The connecting rod also includes a pull rod connected to the force-bearing rode. The connecting rod further includes a baffle column on the pull rod. The level-1 elastic component provides a first elastic force for the force-bearing rod, so that the baffle column is caused to abut against a surface of the air baffle opposite to the module insertion port. The level-2 elastic component provides a second elastic force for the air baffle.
Public/Granted literature
- US20200323106A1 AIR BAFFLE COMPONENT, HEAT DISSIPATION APPARATUS, AND SERVER Public/Granted day:2020-10-08
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