Invention Grant
- Patent Title: Component mounting machine
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Application No.: US16497664Application Date: 2017-03-29
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Publication No.: US11229151B2Publication Date: 2022-01-18
- Inventor: Kenzo Ishikawa , Jun Iisaka , Hidetoshi Ito
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/012905 WO 20170329
- International Announcement: WO2018/179139 WO 20181004
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04

Abstract:
A component mounting machine including a head unit that has a head main body configured to hold multiple pickup members each capable of picking up a component at a predetermined interval along a predetermined circumference and to be capable of rotating forward and reverse directions; a moving device configured to move the head unit; a lifting and lowering device configured to lift and lower a pickup member; a component supply device configured to be capable of supplying the component to the pickup member; and a control device configured to control those described above. The control device performs a control such that the pickup members pick up the components supplied by the component supply device, and each component is mounted on a board after a completion of the pickup, while performing an operation of rotating the head main body and an operation of moving the head unit together.
Public/Granted literature
- US20200037481A1 COMPONENT MOUNTING MACHINE Public/Granted day:2020-01-30
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