Invention Grant
- Patent Title: Image sensor having shielding interconnects
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Application No.: US16662420Application Date: 2019-10-24
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Publication No.: US11233084B2Publication Date: 2022-01-25
- Inventor: Jong-Hwan Shin , Hye-Won Mun , Hoon-Sang Oh
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Perkins Coie LLP
- Priority: KR10-2019-0039956 20190405
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor includes one or more first unit pixels. Each of the one or more first unit pixels may include a first photoelectric conversion region including first photoelectric conversion elements arranged in the form of a matrix, and a first floating diffusion region at a center of the first photoelectric conversion elements; a first transistor region including a first active region in which a first reset gate, a first select gate and a first drive gate are disposed; a first signal interconnect electrically connecting the first floating diffusion region to the first drive gate; and a first shielding interconnect separated from the first signal interconnect and extending parallel to the first signal interconnect.
Public/Granted literature
- US20200321382A1 IMAGE SENSOR HAVING SHIELDING INTERCONNECTS Public/Granted day:2020-10-08
Information query
IPC分类: