Invention Grant
- Patent Title: Nitride semiconductor device and nitride semiconductor package
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Application No.: US16405417Application Date: 2019-05-07
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Publication No.: US11233144B2Publication Date: 2022-01-25
- Inventor: Taketoshi Tanaka
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2016-163743 20160824,JP2017-006779 20170118,JP2017-057830 20170323,JP2017-132170 20170705
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/778 ; H01L29/205 ; H01L29/47 ; H01L29/66 ; H01L23/495 ; H01L23/31 ; H01L29/10 ; H01L29/40 ; H01L29/417 ; H01L29/43 ; H01L29/45 ; H01L29/49

Abstract:
Provided is a nitride semiconductor device 3 including a GaN electron transit layer 13, an AlGaN electron supply layer 14 in contact with the electron transit layer 13, a gate layer 15, formed selectively on the electron supply layer 14 and constituted of a nitride semiconductor composition effectively not containing an acceptor type impurity, and a gate electrode 16, formed on the gate lever 15, and satisfying the following formula (1): d G 2 E F q ( N DA + N A - N DD - N D ) ɛ 0 ɛ C + Φ B - d B P ɛ 0 ɛ B > 0 ( 1 )
Public/Granted literature
- US20190267483A1 NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR PACKAGE Public/Granted day:2019-08-29
Information query
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