Invention Grant
- Patent Title: Circuit board structure and fabricating method thereof, display panel and fabricating method thereof
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Application No.: US16556390Application Date: 2019-08-30
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Publication No.: US11234332B2Publication Date: 2022-01-25
- Inventor: Chunghao Cheng
- Applicant: Ordos Yuansheng Optoelectronics Co., Ltd. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Ordos; CN Beijing
- Assignee: Ordos Yuansheng Optoelectronics Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: Ordos Yuansheng Optoelectronics Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Ordos; CN Beijing
- Agency: Thomas | Horstemeyer, LLP
- Priority: CN201910156920.5 20190301
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18
Abstract:
A circuit board structure includes a circuit board body having an adsorption surface; an auxiliary board on which a binding mark is disposed. The auxiliary board is spliced to the circuit board body, and a surface of the auxiliary board is flush with the adsorption surface. A part of the adsorption surface and a part of the surface of the auxiliary board together form an adsorption zone.
Public/Granted literature
- US20200281080A1 CIRCUIT BOARD STRUCTURE AND FABRICATING METHOD THEREOF, DISPLAY PANEL AND FABRICATING METHOD THEREOF Public/Granted day:2020-09-03
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