Invention Grant
- Patent Title: 3-D printing
-
Application No.: US16077752Application Date: 2017-07-14
-
Publication No.: US11235521B2Publication Date: 2022-02-01
- Inventor: Shannon Reuben Woodruff , Ali Emamjomeh , Yi Feng , Erica Fung , Carolin Fleischmann , Geoffrey Schmid
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2017/042098 WO 20170714
- International Announcement: WO2019/013814 WO 20190117
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y70/00 ; B33Y10/00 ; B29K67/00 ; B29K77/00

Abstract:
This disclosure relates to a method of 3-D printing comprising: applying a layer of build material onto a print platform, wherein the build material comprises particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group; printing a de-protecting agent at selected locations on the layer of build material; and coalescing particles of the polymer at the printed locations on the layer of build material to form a coalesced polymer layer.
Public/Granted literature
- US20210197455A1 3-D PRINTING Public/Granted day:2021-07-01
Information query