Invention Grant
- Patent Title: Plasticizing device, three-dimensional modeling device, and injection molding device
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Application No.: US16675299Application Date: 2019-11-06
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Publication No.: US11235526B2Publication Date: 2022-02-01
- Inventor: Kei Yokota
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2018-209678 20181107,JPJP2018-209680 20181107,JPJP2018-209681 20181107
- Main IPC: B29C64/314
- IPC: B29C64/314 ; B29C64/209 ; B29C64/241 ; B29C64/255 ; B29C64/245 ; B33Y40/00 ; B33Y30/00

Abstract:
A plasticizing device that plasticizes a material to produce a molten material includes a driving motor, a screw that has a grooved surface on which a groove is formed and rotates by the driving motor; and a barrel having a facing surface that faces the grooved surface and has a communication hole formed in the center and a heater, wherein the screw has a cooling medium flow path provided inside the screw, an inlet portion that communicates with the cooling medium flow path and introduces a cooling medium from the outside of the screw, and an outlet portion that communicates with the cooling medium flow path and discharges the cooling medium to the outside of the screw.
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