Invention Grant
- Patent Title: Flow path structure, liquid ejecting head, and liquid ejecting apparatus
-
Application No.: US16891164Application Date: 2020-06-03
-
Publication No.: US11235575B2Publication Date: 2022-02-01
- Inventor: Isamu Togashi , Hiroaki Okui , Yasuyuki Kudo , Fujio Akahane
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2014-053757 20140317,JP2014-053758 20140317
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A flow path structure includes: a substrate that includes a first surface and a second surface on a side opposite to the first surface; a supply port formed on the first surface; a plurality of discharge ports formed on the second surface; grooves that are formed on the first surface so as to extend in an X direction and communicate with the supply ports and with the plurality of discharge ports via through-holes formed on the substrate; and a sealing portion that is disposed on the first surface and seals each groove.
Public/Granted literature
- US20200331269A1 FLOW PATH STRUCTURE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2020-10-22
Information query
IPC分类: