Head module and head unit
Abstract:
There is provided a head module including: a liquid discharging head; a driver IC; a heat sink; and a fan. The head module includes: a channel unit; and an energy-applying mechanism. The heat sink includes: a base part; and a plurality of fins including: a first fin, a second fin, and a third fin. A plane direction of a plane in which the first fin expands crosses a plane direction of a plane in which the second fin expands, and crosses a plane direction of a plane in which the third fin expands. The fan is arranged at a position at which the fan overlaps with the base part in the first direction, and in a space surrounded by the first fin, the second fin, the third fin and the base part.
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