Invention Grant
- Patent Title: Head module and head unit
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Application No.: US17113688Application Date: 2020-12-07
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Publication No.: US11235605B2Publication Date: 2022-02-01
- Inventor: Keita Sugiura
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya
- Agency: Scully, Scott, Murphy & Presser, PC
- Priority: JPJP2019-226448 20191216
- Main IPC: B41J29/377
- IPC: B41J29/377 ; B41J2/14

Abstract:
There is provided a head module including: a liquid discharging head; a driver IC; a heat sink; and a fan. The head module includes: a channel unit; and an energy-applying mechanism. The heat sink includes: a base part; and a plurality of fins including: a first fin, a second fin, and a third fin. A plane direction of a plane in which the first fin expands crosses a plane direction of a plane in which the second fin expands, and crosses a plane direction of a plane in which the third fin expands. The fan is arranged at a position at which the fan overlaps with the base part in the first direction, and in a space surrounded by the first fin, the second fin, the third fin and the base part.
Public/Granted literature
- US20210178788A1 HEAD MODULE AND HEAD UNIT Public/Granted day:2021-06-17
Information query
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