A system for measuring parameters of a mounted assembly comprises an electronic device for measuring parameters of the mounted assembly and a bonding interface made of elastomeric material surrounding the electronic device. The measuring electronic device comprises: a UHF radiofrequency antenna; and an electronic board with an electronic chip coupled to the UHF radiofrequency antenna, a sensor for measuring parameters of the mounted assembly, a microcontroller and an electrical circuit. The measuring system comprises a ground plane connected to the electronic board. The electronic board comprises an energy manager and a capacitive element. The coupling between the electronic chip and the UHF radiofrequency antenna is of an electrical nature. The electronic chip, the microcontroller and the measuring sensor are components of low energy consumption.