Invention Grant
- Patent Title: Epoxy resin composition
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Application No.: US16752923Application Date: 2020-01-27
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Publication No.: US11236228B2Publication Date: 2022-02-01
- Inventor: Nobuo Miyatake
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2017-147012 20170728
- Main IPC: C08G59/50
- IPC: C08G59/50 ; C08L63/00 ; C08L63/10 ; C08F279/02 ; C08G59/24 ; C09J163/00 ; C09D163/00

Abstract:
An epoxy resin composition includes a polyol (A) having a hydroxyl value of 130 to 600 mgKOH/g, an epoxy resin (B), an amine curing agent (C), and a toughener (D). The epoxy resin composition may satisfy both 0.1≤Wt2/Wp≤8.0 and 0.1≤Wp≤8.0, where Wp represents the polyol (A) content of the composition in % by weight and Wt represents the toughener (D) content of the composition in % by weight, relative to a total amount of the polyol (A), the epoxy resin (B), the amine curing agent (C), and the toughener (D).
Public/Granted literature
- US20200157340A1 EPOXY RESIN COMPOSITION Public/Granted day:2020-05-21
Information query
IPC分类: