Invention Grant
- Patent Title: Moisture-curable hot melt adhesive
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Application No.: US16013198Application Date: 2018-06-20
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Publication No.: US11236257B2Publication Date: 2022-02-01
- Inventor: Kenji Matsuda , Ai Takamori , Tsuyoshi Tamogami
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Priority: JPJP2015-254365 20151225
- Main IPC: C09J175/08
- IPC: C09J175/08 ; C09J125/16 ; C08G18/76 ; C08G18/40 ; C08G18/42 ; C08G18/48 ; C09J173/00 ; C08L29/04 ; C08L23/02 ; C09J175/04 ; C08L23/04 ; C08L25/16 ; B32B27/40 ; B32B27/36 ; C08G65/26 ; C08L75/04 ; B32B7/12 ; B32B27/06 ; B32B21/02 ; B32B21/14 ; B32B27/32 ; C08L23/10 ; B32B13/10 ; B32B27/08 ; B32B13/08 ; B32B21/08 ; B32B27/30 ; B32B29/00 ; B32B21/04 ; B32B21/13 ; B32B13/12 ; B32B21/06 ; B32B27/10
Abstract:
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
Public/Granted literature
- US20180298254A1 Moisture-Curable Hot Melt Adhesive Public/Granted day:2018-10-18
Information query
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