Invention Grant
- Patent Title: Thermally conductive composition
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Application No.: US16768193Application Date: 2018-12-03
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Publication No.: US11236259B2Publication Date: 2022-02-01
- Inventor: Gaku Kitada , Keita Ishida
- Applicant: SEKISUI POLYMATECH CO., LTD.
- Applicant Address: JP Saitama
- Assignee: SEKISUI POLYMATECH CO., LTD.
- Current Assignee: SEKISUI POLYMATECH CO., LTD.
- Current Assignee Address: JP Saitama
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-232652 20171204
- International Application: PCT/JP2018/044405 WO 20181203
- International Announcement: WO2019/111852 WO 20190613
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/08 ; C08K3/22 ; C08L83/00 ; C08K3/10 ; C08K3/14 ; C08K3/18 ; C08K3/20 ; C08K3/34 ; C08K13/00
Abstract:
The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.
Public/Granted literature
- US20200291283A1 THERMALLY CONDUCTIVE COMPOSITION Public/Granted day:2020-09-17
Information query
