Invention Grant
- Patent Title: Process kit for improving edge film thickness uniformity on a substrate
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Application No.: US16672327Application Date: 2019-11-01
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Publication No.: US11236424B2Publication Date: 2022-02-01
- Inventor: Muhannad Mustafa , Muhammad M Rasheed
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: C23C16/40
- IPC: C23C16/40 ; C23C16/458 ; C23C16/46 ; C23C16/44 ; C23C16/455

Abstract:
Embodiments of process kits for us in a substrate processing chamber are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes an annular body configured to surround a substrate support and having an upper portion, a lower portion, and a central opening through the upper portion and the lower portion, wherein the upper portion includes sidewalls coupled to an upper flange that defines an outer diameter of the annular body, wherein the upper portion includes a plurality of first holes disposed through the sidewalls, and wherein the upper portion includes one or more heating elements; and a shield disposed about the annular body, wherein the shield includes an exhaust port fluidly connected to the plurality of first holes.
Public/Granted literature
- US20210130953A1 PROCESS KIT FOR IMPROVING EDGE FILM THICKNESS UNIFORMITY ON A SUBSTRATE Public/Granted day:2021-05-06
Information query
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