• Patent Title: Device that holds substrate in substrate holder and/or releases holding of substrate using substrate holder, and plating apparatus including the same
  • Application No.: US16592770
    Application Date: 2019-10-04
  • Publication No.: US11236434B2
    Publication Date: 2022-02-01
  • Inventor: Takuya Tsushima
  • Applicant: EBARA CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: EBARA CORPORATION
  • Current Assignee: EBARA CORPORATION
  • Current Assignee Address: JP Tokyo
  • Agency: JCIPRNET
  • Priority: JPJP2018-190116 20181005
  • Main IPC: C25D17/06
  • IPC: C25D17/06
Device that holds substrate in substrate holder and/or releases holding of substrate using substrate holder, and plating apparatus including the same
Abstract:
A substrate attachment and detachment device appropriate for a double-sided holder is provided. The substrate attachment and detachment device is a device that holds a substrate in a substrate holder and/or releases the holding of the substrate using the substrate holder. The substrate holder includes a first frame and a second frame. The first frame and the second frame have openings, respectively. The device includes a substrate supporting unit that sandwiches the substrate between the first frame and the second frame. The substrate supporting unit includes a lower substrate supporter, and an upper substrate supporter. The lower substrate supporter is configured to come into contact with the substrate through the opening of the frame positioned on a lower side. The upper substrate supporter is configured to come into contact with the substrate through the opening of the frame positioned on an upper side.
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