Invention Grant
- Patent Title: Stress reduced diaphragm for a micro-electro-mechanical system sensor
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Application No.: US16542452Application Date: 2019-08-16
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Publication No.: US11237043B2Publication Date: 2022-02-01
- Inventor: Pirmin Rombach , Sushil Bharatan
- Applicant: INVENSENSE, INC. , TDK Electronics AG
- Applicant Address: US CA San Jose; DE Munich
- Assignee: INVENSENSE, INC.,TDK Electronics AG
- Current Assignee: INVENSENSE, INC.,TDK Electronics AG
- Current Assignee Address: US CA San Jose; DE Munich
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: G01H11/06
- IPC: G01H11/06 ; G01L9/00

Abstract:
A micro-electro-mechanical system (MEMS) sensor can comprise a substantially rigid layer having a center. The MEMS sensor can further comprise a movable membrane that can be separated by a gap from, and be disposed substantially parallel to, the substantially rigid layer. The MEMS sensor can further include a plurality of pedestals extending into the gap, where a first pedestal of the plurality of pedestals can be of a first size, and be disposed a first distance from the center, and a second pedestal of the plurality of pedestals can be a second size different from the first size, and be disposed at a second distance from the center. In another aspect, the substantially rigid layer and the movable membrane can be suspended by a plurality of suspension points. In another aspect, at least one of the plurality of pedestals can be disposed so as to limit a deformation of the movable membrane.
Public/Granted literature
- US20200056935A1 STRESS REDUCED DIAPHRAGM FOR A MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR Public/Granted day:2020-02-20
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