Invention Grant
- Patent Title: Physical vapor deposition system and processes
-
Application No.: US16801642Application Date: 2020-02-26
-
Publication No.: US11237473B2Publication Date: 2022-02-01
- Inventor: Vibhu Jindal , Wen Xiao , Sanjay Bhat
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: G03F1/24
- IPC: G03F1/24
Abstract:
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets. A process for improving reflectivity from a multilayer stack is also disclosed.
Public/Granted literature
- US20200277698A1 Physical Vapor Deposition System And Processes Public/Granted day:2020-09-03
Information query
