Invention Grant
- Patent Title: Dual-axis hinge assembly for electronic devices
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Application No.: US16639623Application Date: 2017-08-17
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Publication No.: US11237599B2Publication Date: 2022-02-01
- Inventor: Chung-Hua Ku , Wei-Chung Chen , Kuan-Ting Wu
- Applicant: HEWLETT-PACHKARD DEVELOPMENT COMPANY , L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACHKARD DEVELOPMENT COMPANY , L.P.
- Current Assignee: HEWLETT-PACHKARD DEVELOPMENT COMPANY , L.P.
- Current Assignee Address: US TX Spring
- Agency: Global IP Services PLLC
- International Application: PCT/US2017/047257 WO 20170817
- International Announcement: WO2019/035833 WO 20190221
- Main IPC: G06F1/16
- IPC: G06F1/16 ; E05D11/08

Abstract:
In one example, a dual-axis hinge assembly for an electronic device is disclosed, which may include a casing defining a pair of slots and an elastic member disposed in the casing. The elastic member may include mounting features at opposite ends. The dual-axis hinge assembly may include a pair of shafts received through a respective one of the mounting features and the slots, and engaged with display housing and a main housing of the electronic device to pivotably connect the display housing to the man housing. The elastic member may enable at least one of the shafts to slide along the slots to variably adjust a distance between a pivot axis of the display housing and a pivot axis of the main housing.
Public/Granted literature
- US20200241602A1 DUAL-AXIS HINGE ASSEMBLY FOR ELECTRONIC DEVICES Public/Granted day:2020-07-30
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