Invention Grant
- Patent Title: Chip ejecting apparatus
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Application No.: US16568562Application Date: 2019-09-12
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Publication No.: US11239104B2Publication Date: 2022-02-01
- Inventor: Jae Ryoung Lee , Sang Hwan Kim , Min Sung Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0028028 20190312
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B32B43/00 ; H01L21/67

Abstract:
A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.
Public/Granted literature
- US20200294839A1 CHIP EJECTING APPARATUS Public/Granted day:2020-09-17
Information query
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