Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body
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Application No.: US16487017Application Date: 2017-05-10
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Publication No.: US11239124B2Publication Date: 2022-02-01
- Inventor: Yukimasa Hayashida
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2017/017672 WO 20170510
- International Announcement: WO2018/207279 WO 20181115
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/24 ; H01L23/31 ; H01L25/18 ; H01L23/04 ; H01L21/48 ; H01L23/29 ; H01L25/07

Abstract:
An object is to provide a technique capable of fixing a cover to a container body without using a dedicated fixation mechanism and fixation member. A semiconductor device includes: a container body having a space with an opening; a semiconductor element disposed in the space in the container body; a sealing member disposed in the space in the container body to cover the semiconductor element; and a cover covering the opening of the container body, wherein a convex portion protruding into the space is provided on the cover, and the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured.
Public/Granted literature
Information query
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