Invention Grant
- Patent Title: Carrier structure and package structure
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Application No.: US16232735Application Date: 2018-12-26
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Publication No.: US11239125B2Publication Date: 2022-02-01
- Inventor: Hsien-Lung Hsiao , Yu-Cheng Pai , Chia-Chi Lo , Szu-Hsien Chen , Shu-Chi Chang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW107126152 20180727
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/498 ; H01L23/00 ; H01L23/60
Abstract:
A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.
Public/Granted literature
- US20200035573A1 CARRIER STRUCTURE AND PACKAGE STRUCTURE Public/Granted day:2020-01-30
Information query
IPC分类:
