A panel type fan-out wafer level package with embedded film type capacitors and resistors is described. The package comprises a silicon die at a bottom of the package wherein a top side and lateral sides of the silicon die are encapsulated in a molding compound, at least one redistribution layer connected to the silicon die through copper posts contacting a top side of the silicon die, at least one embedded capacitor material (ECM) sheet laminated onto the package, and at least one embedded resistor-conductor material (RCM) sheet laminated onto the package wherein the at least one redistribution layer, capacitors in the at least one ECM, and resistors in the at least one RCM are electrically interconnected.